例句與造句

1. Test method for exothermic temperature of encapsulating compounds for electronic and microelectronic encapsulation
   電子元件及微電子元件封裝用密封化合物發(fā)熱溫度測(cè)試方法
2. Standard test method for exothermic temperature of encapsulating compounds for electronic and microelectronic encapsulation
   電子元件及微電子元件封裝用密封化合物發(fā)熱溫度的標(biāo)準(zhǔn)試驗(yàn)方法
3. Test method for fluid and grease resistance of thermoset encapsulating compounds used in electronic and microelectronic applications
   用于電子和微電子設(shè)備的熱固性封裝復(fù)合劑的耐液體和油脂的試驗(yàn)方法
4. Standard test method for fluid and grease resistance of thermoset encapsulating compounds used in electronic and microelectronic applications
   電子和微電子學(xué)應(yīng)用的熱固性密封膠的耐流體和滑脂性能的標(biāo)準(zhǔn)試驗(yàn)方法
5. Low viscosity , excellent electrical properties , used extensively as a high voltage potting compound as well as an encapsulating compound for delicate circuitry , can be used with various curing agents , thus varying pot life , cure time , mix ratios and cure conditions
   低粘度，有著出色的電氣性能，廣泛地應(yīng)用為高壓灌封化合物和精密電路密封化合物，可與多種催化劑使用，可改變灌膠時(shí)間、固化時(shí)間、混合比率以及固化條件。
6. It's difficult to find encapsulating compound in a sentence. 用encapsulating compound造句挺難的